Device Description:
The magnetron sputtering vacuum coating machine is a vertical single-door unbalanced magnetron reactive sputtering coating machine. The film deposited by this device is improved in density, uniformity, purity, hardness and the like. Widely used in high-end decorative and functional films in the fields of watches, glasses, telecommunications, electronics, machinery, decoration and transportation aviation.
main feature:
1. The deposition rate is fast and the temperature rise is small, which can better suppress the phenomenon of ignition and target poisoning;
2. The high energy released by sputtering significantly increases the film density and adhesion;
3, touch screen + PLC, can achieve automatic control, automatic / manual switch at any time;
4. The coating chamber has a large volume, large loading capacity and high production efficiency.
5. The workpiece frame adopts a public rotation structure, which can be set with automatic forward and reverse, and the product uniformity is good;
6. The whole machine is configured reasonably, the pumping speed is fast, the noise is small, and the energy consumption is low;
basic configuration:
1. The coating chamber, valve and pipeline are made of stainless steel, vertical and single-opening structure, and the effective diameter of the vacuum chamber is from Φ1000mm-Φ1800mm;
2. The vacuum system consists of a mechanical pump, a rotary vane pump, a Roots pump and a high vacuum oil diffusion pump or molecular pump with a cold trap;
3. The coating system uses 2~8 sets of flat targets or column targets, equipped with 2~8 DC power supplies or intermediate frequency power supplies;
4. The auxiliary pumping system uses a low temperature water vapor trap;
5. The inflation system is controlled by a 1~4 way gas flow meter and a flow control (display) meter;
6. the electric control system sets the circuit overload, water, air and sound and light alarm device;
7. Control system (touch screen + PLC), display detailed parameters in real time, fully control the entire production process, and automatically store process parameters;
8. can be equipped with multiple sets of target sources according to customer requirements.
Technical Parameters: